The new ultra-thin compact E5S product is designed with diamond-cut process, with die-cast molding and cable-free industry to show quality and stability. The entire machine is developed based on the Intel Apollo Lake platform, with high-speed memory directly onboard to effectively resist vibration and shock. The anti-adhesive zero-distance fanless cooling solution, coupled with wide-voltage power input performance, meets a variety of demanding industrial application scenarios, and the integrated Intel dual-network guarantees efficient and error-free terminal data acquisition, monitoring and control. Suitable for various embedded and terminal applications.