The new ultra-thin compact E5 products are designed with diamond-cut technology, with die-casting molding and cable-free process to show quality and stability. The entire machine is developed based on Intel Bay Trail platform, with high-speed memory directly onboard, effectively resisting vibration and shock. The anti-adhesive zero-distance fanless cooling program, coupled with wide-voltage power input performance, to meet a variety of harsh industrial applications, integrated Intel dual-network to protect the terminal data acquisition, monitoring and control of efficient and error-free. Suitable for various embedded and terminal applications.